W.H. Cheng, M.T. Sheen, C.P. Chien, H.L. Chang, "Reduction of Fiber Alignment Shifts in Laser Module
Packaging," J. Lightwave Technol., 18 (2000). NSC88-2215-E-110-007

W.H. Cheng, S.F. Chiu, C.Y. Hong, and H.W. Chang, "Spectral Characteristics for a Fiber Grating External
Cavity Laser," Optical and Quantum Electronics, 32, (2000). NSC88-2215-E-110-002

W.H. Cheng, J.Y. Cheng, T.L. Wu, C.M. Wang, S.C. Wang, and W.S. Jou, "Electromagnetic Shielding of Plastic
Packaging in Low-Cost Laser Modules, "Eletronics Letters, 36, 118 (2000). NSC88-2215-E-110-007

W.H. Cheng, S.F. Chiu, C.Y. Hong, and H.W. Chang, "Spectral
Characteristics for a Fiber Grating External Cavity Laser," Optical
and Quantum Electronics, 31, (to be published in 1999).
NSC88-2215-E-110-002

W.H. Cheng, S.F. Chiu, and A.K. Chu,"Effect of Thermal Stresses on
Temperature Dependence of Refractive Index for Ta2O5 Dielectric
Films, "Thin Solid Films, 340, 233 (1999). NSC87-2215-E-110-002

W.H. Cheng, Y.D. Yang, T.C. Liang, G.L. Wang, M.T. Sheen, and J.H.
Kuang, "Thermal Stresses in Box-Type Laser Packages," Optical and
Quantum Electronics, 31, 293 (1999). NSC87-2215-E-110-002

W.H. Cheng, M.T. Sheen, J.K. Kuang, and C.H. Chen, "The Principle Cause of
Crack Defects in Optoelectronic Materials with Phosphorus-Containing
Underlayer," J. Electronic Materials, 28, 50 (1999).
NSC87-2215-E-110-006

J.K. Kuang, M.T. Sheen, S.C. Wang, C.H. Chen, and W.H. Cheng, "Crack
Formation Mechanism in Laser-Welded Au-Coated Invar Materials for
Semiconductor Laser Packages," IEEE Trans. Comp., Hybrids, Manu.
Technol. Part B, 22, 94 (1999) NSC87-2215-E-110-006

W.H. Cheng, S.C. Wang, Y.K. Tu, C.H. Chen, and K.C. Hsieh, "Defect in
Optoelectronic Materials Due to Phosphorus-Containing Underlayer," J.
Electronic Materials, 27, L 47 (1998). NSC87-2215-E-110-006

S.C. Wang, S. Chi, and W.H. Cheng, "A Simple Passive Aligned Packaging
Technique for Laser to Single-Mode Fiber Modules," Materials Chemistry
and Physics, 56, 189 (1998). NSC87-2215-E-110-002

W.H. Cheng, W.H. Wang, Y.D. Yang, and J.H. Kuang, "Effects of Au
Coating on Thermal Stresses in Stainless-to-Kovar Joints," Optical
and Quantum Electronics, 29, 939 (1997). NSC86-2215-E-110-005

S.C. Wang, S. Chi, K.C. Hsieh, Y.D. Yang, and W.H. Cheng, "Direct Evidence
of Au Segregation in Laser Welded Au-Coated Invar Materials," J.
Electronic Materials, 26, L21 (1997). NSC86-2215-E-110-005

W.H. Cheng, Y.D. Yang, S.C. Wang, S. Chi, M.T. Sheen, and J.K. Kuang,
"Effect of Au Thickness on Laser Beam Penetration in Semiconductor Laser
Packages," IEEE Trans.Comp., Hybrids, Manu.Technol.Part B, 20, 396,
(1997). NSC86-2215-E-110-005

A.K. Chu, H.C. Lin, and W.H. Cheng, " Characterize Index-Versus-Temperature
of Ta2O5 Thin Films, " J. Electronic Materials, 26, 889, (1997)
NSC86-2215-E-110-001

W.H. Cheng, C.H. Hsia, J.C. Lin, and H.M. Chen, "A Simple Angular Technique
for Polarization-Maintaining-Fiber to Integrated-Optic Waveguide with
Angled Interface,"Materials Chemistry and Physics, 44, 88 (1997).
NSC86-2623-D-110-003

W.H. Cheng, W.H. Wang, and J.C. Chen, "Defect Formation Mechanisms in Laser
Welding Technique for Semiconductor Laser Packaging," IEEE Trans. Comp.,
Hybrids, Manu. Technol., Part B, 19, 764 (1996). NSC85-2215-E-110-007

W.H. Cheng, W.H. Wang, J.C. Chen, H.Y. Chen, W.T. Chen, S.T. Chang,
J.S. Horng, H.H. Lin, and M.J. Sun, "Reduction of Post-Weld-Shift in
Semiconductor Laser Packaging," Optical and Quantum Electronics, 28,
1741, (1996). NSC85-2215-E-110-004

W.H. Cheng, W.H. Wang, J.C. Chen, H.Y. Chen, W.T. Chen, S.T. Chang,
J.S. Horng, H.H. Lin, and M.J. Sun, "Reduction of Post-Weld-Shift in
Semiconductor Laser Packaging," Optical and Quantum Electronics, 28,
1741, (1996). NSC85-2215-E-110-004

S.C.Wang, C.M.Wang, H.L.Chang, Y.K.Tu, C.J.Hwang, C.Chi, W.H.Wang,
Y.D.Yang, and W.H.Cheng, "Effect of Thin Film Coating fo Au on Joint Strength
in Invar-Invar Packages," J Electronic Materials, 25,1797,(1996).NSC85-2215-E-110-007

S.C. Wang, C.M. Wang, H.L. Chang, C. Wang, Y.K. Tu, C.J. Hwang, S. Chi, W.H. Wang, and W.H. Cheng, "The Dependence of Joint Joint Strength on Au Coating in Semiconductor Laser Packaging," submit for publication.

W.H. Cheng, and A.K. Chu, "The Dependence of Carrier Lifetime on Spectral Width in Multimode Semiconductor Lasers," IEEE Photo. Technol. Lett., 8, May, (1996).

A.K. Chu, C.J. Lin, and W.H. Cheng, "Multilayer Dielectric of TiO2/Ta2O5/SiO2 for Temperature-Stable Diode Lasers, " Materials Chemistry and Physics, 42, 214, (1995).

W.H. Cheng, "Effect of Carrier Lifetime on Mode Partition Noise in Multimode Semiconductor Lasers," IEEE Photo. Technol. Lett., 6, 355, March (1994).

W.H. Cheng ,and J. Bechtel, "High-Speed Fiber Optic Links Using 780 nm Compact Disc Lasers," Electron. Lett., 29, 2055, Nov. ( 1993).

W.H. Cheng, A. Mar, J.E. Bowers, R.T. Huang, and C.B. Su, "High-Speed 1.3 mm InGaAsP Fabry-Perot Lasers for Digital and Analog Applications," IEEE J. Quantum Electron., 29, 1660, June (1993).

W.H. Cheng, J.M. Dugan, J.C. Miller, D. Renner, T.C. McDermott, and C.B. Su, "1.3 mm InGaAsP Fabry-Perot Lasers with Reduced Pulse Jitter and Power Penalty," Electron. Lett., 28, 1337, July (1992).

R.T. Huang, D. Wolf, W.H. Cheng, C.L. Jiang, R. Agarwal, A. Mar, and J.E. Bowers, "High-Speed Low-Threshold InGaAsP Semi-Insulating Buried Crescent Lasers with 22 GHz Bandwidth," IEEE Photo. Technol., Lett. 4, 293, Apr. (1992).

W.H. Cheng, K.D. Buehring, A. Appelbaum, D. Renner, S. Shin, C.B. Su, A. Mar, and 9J.E. Bowers, "High-Speed and Low-Relative-Intensity Noise 1.3 mm InGaAsP Semi-Insulating Buried Crescent Lasers," IEEE J. Quantum Electron., 27, 1642, June (1991).

W.H. Cheng, H. Kuwamoto, A. Appelbaum, D. Renner, and S.W. Zehr, "Effect of Zinc Diffusion from Overgrown p-InP Layers on Semi-Insulating InP," J. Appl. Phys., 69, 1862, Feb. (1991).

H.L. Chang, S.C. Wang, C. Wang, C.M. Wang, T.T. Shi, M.T. Sheen, C.P.
Chien, J.C. Chen, G.L. Wang, J.K. Kuang, K.C. Hsieh, and W.H. Cheng,
"Effect of Joint Strength of PbSn and AuSn Solders on Temperature
Cycling in Laser Packages," LEOS'99, Nov. 8-11, San Francisco, CA
(1999).

S.C. Wang, H.L. Chang, C. Wang, C.M. Wang, J.W. Liaw, M.T. Sheen, J.K.
Kuang, C.P. Chien, and W.H. Cheng, Y.D. Yang, "Post-Weld-Shift in
Semiconductor Laser Packaging," ECTC, June 1-4, San Diego, CA (1999).

C.S. Hsieh and W.H. Cheng, "Direct Correlation between Device and
Technological Parameters in Fusion Fiber Coupler," CLEO, May 23-28,
Baltimore, Maryland (1999).

H.L. Chang, S.C. Wang, C. Wang, C.M. Wang, J.W. Liaw, M.T. Sheen, Y.C.
Sheu, J.K. Kuang, C.H. Chen, and W.H. Cheng, "Thermally Induced Shifts
of an Optical Fiber into a Ferrule," LEOS'98, Dec.1-4, Orlando, Florida
(1998).

K.C. Hsieh, Y.K. Tu, S.C. Wang, H.L. Chang, C. Wang, C.M. Wang, J.W.
Liaw, G.L. Wang, C.H. Chen, and W.H. Cheng, "Defect in Optoelectronic
Packaging Due to Phosphorus Content of the Underlayer Coating,"CLEO, May
3-8, San Francisco, CA (1998).

S.C. Wang, H.L. Chang, C. Wang, C.M. Wang, J.W. Liaw, M.T. Sheen, J.H.
Chen, Y.D. Yang, J.K. Kuang, K.C. Hsieh, and W.H. Cheng, "Residual
Stresses in Semiconductor Laser Packaging," LEOS'97, Nov.10-13, San
Francisco, CA (1997).

S.C. Wang, H.L. Chang, C. Wang, C.M. Wang, J.W. Liaw, M.T. Sheen, J.K.
Kuang, S. Chi, and W.H. Cheng, Y.D. Yang,, "Effect of Au Coating on
Laser Beam Penetration in Invar-to-Invar Packages," ECTC, May 18-21, San
Jose, CA (1997).

W.H. Wang, I.D. Yang, J.H. Kuang, and W.H. Cheng, "Thermally Induced
Stresses in Semiconductor Laser Packaging," LEOS'96, Nov. 18-21, Boston,
MA (1996).

J.C. Chen, W.T. Chen, S.T. Chang, J.S. Horng, H.H. Lin, M.J. Sun, W.H. Cheng, and W.H. Wang, "The Failure Mechanisms in Semiconductor Laser Packaging," CLEO, June 2-7, Anaheim, California (1996).

S.C. Wang, Y.K. Tu, C.J. Hwang, W.H. Wang, and W.H. Cheng, "Effect of Au Plating on Joint Strength in Laser Welding for Invar-Invar Packages," ECTC, May 28-31, Orlando, Florida (1996).

J.C. Chen, W.T. Chen, S.T. Chang, J.S. Horng, H.H. Lin, M.J. Sun, W.H. Wang, and W.H. Cheng, "Failure Mechanisms of Solidification Crackls in Semiconductor Laser Packaging," ECTC, May 28-31, Orlando, Florida (1996).

H.C. Lin, A.K. Chu, and W.H. Cheng, "A Novel Dielectric Material System for High-Density WDM Applications," Dec. 16, Taipei, Taiwan (1995).

W.H. Cheng, W.H. Wang, H.Y. Chen, and H.H. Lin, "Reduction of Micromovement in Optoelectronicr Packaging," LEOS'95, Oct. 30 - Nov. 2, San Francisco, California (1995).

H.Y. Chen, H.H. Lin, W.H. Wang, and W.H. Cheng, "Reduction of Micromovement in Laser Packaging," URSI, Aug. 7-8, Kaohsiung, Taiwan (1995).

W.H. Wang, W.H. Cheng, H.Y. Chen, H.H. Lin, "Optoelectronic Packaging Investigation by Metallographic Method," Electronic Materials and Devices Conference, pp. 315-317, July 6 - 7, Kaohsiung, Taiwan (1995).

W.H. Cheng, Y.M. Huang, H.Y. Chen, H.H. Lin, "Failure Mechanism of Hole Formation in Laser Welding Technique for Optoelectronic Packaging," ECTC, pp. 914-916, May 21-24, Las Vegas, Nevada (1995).

A.K. Chu, C.J. Lin, and W.H. Cheng, "Multilayer Dielectric Materials of TiO2/Ta2O5 /SiO2 for temperature-Stable Diode Lasers, Proceedings of IUMRS International Conference on Electronic Materials, Dec. 19-22, Hsinchu, Taiwan (1994). (NSC83-0417-E-110-009)

W.H. Cheng, and J.H. Bechtel, "Gigabit Fiber Optic Links Using Compact Disc Lasers," SPIE, Jan., Los Angles, CA (1994).

W.H. Cheng, J.M. Dugan, J.C. Miller, R.T. Huang, D. Wolf, D. Renner, T.C. McDermott, and C.B. Su, "The Bit-Error-Rate Performance of a 1.2 Gbits/s Lightwave System Using Multimode Lasers," OFC'92, Technical Digest, TuM, Feb. 3-7, San Jose, CA (1992).

W.H. Cheng, A. Appelbaum, R.T. Huang, D. Renner, and K.R. Cioffi, "High-Frequency 1.3 mm InGaAsP Semi-Insulating Buried Crescent Lasers for Analog Applications," Proceeding of SPIE, 1418, 279, Jan., Los Angles, CA (1991).

雷射二極體構裝技術之近況與趨勢

陳建宏,錢志平,鄭木海, "銲錫固定光纖套管之半導體雷射構裝研究
",光學工程, 64, p. 8 (1998).

鄭木海 "光電構裝毫微米移動在雷射銲接技術之研究 ",工程科技通訊, 31, p. 13 (1998).

鄭木海, "雷射銲接技術構裝光電元件之良率及可靠度",電子資訊,
三卷三期, p. 8 (1997)。

鄭木海, "雷射二極體構裝技術之近況與趨勢",光訊,69, Dec., p.12 (1997)。

鄭木海,江美麗, "出售公司前先為它增值",光訊, 64, 39, Feb.,
p. 39 (1997)。

鄭木海,"雷射二極體封裝技術發展的趨勢",光訊, 46, 29, Apr. (1994)。

鄭木海、江美麗,"如何創業",光訊, 53, 16, Apr. (1995)。